Applications
The wafer bumped product mix which has been processed at ICI, passed customer qualification, been field tested, and then moved into production, spans most of the semiconductor categories and applications.
| These include: | Discretes......................... | Fuses Resistors Inductors Capacitors |
| High Power Devices....... | FETs | |
| RFID Tags...................... | Labels Implants |
|
| MEMs.............................. | Accelerometers Micromirrors |
|
| Smart Cards.................... | Memory Security |
|
| Memory........................... | DRAM SRAM |
|
| Sensors........................... | Hearing
Aids Diodes Image |
|
| Medical........................... | Pacemakers Implants |
|
| Automotive..................... | Under Hood Passenger Compartment |
|
| Space............................. | Satellites |
