Library
| 12) |  |
Pre-Publication Abstract: Scott Popelar and Bob Niemet. "An Evaluation of Wafer Bumping Stencils Based on Solder Transfer Ratios and Predicted Bump Heights", IMAPS 2006 San Diego, CA. |
| 11) | |
Scott Popelar, Andrew Strandjord, and Bob Niemet, "A Compatibility Evaluation of Lead-Based and Lead-Free Solder Alloys in Conjunction with Electroless Nickel / Immersion Gold Flip Chip UBM", To Be Published in Proceedings of IMAPS 2001 Baltimore, Maryland. |
| 10) | |
Scott Popelar and Hazel Schofield, "Evaluation of FlipFET™ Reliability Based on Solder Fatigue Modeling and a Simulated Design of Experiment", Proceedings of 3rd Annual HDI Expo, Phoenix, Arizona, September 25-27, 2000, pp. 947-968. |
| 9) | |
Andrew J.G. Strandjord, Scott F. Popelar, Curt A. Erickson, "Electroless Nickel/Gold Plating On Copper Based Semiconductors", Proceedings of IMAPS 2000 Boston, September 20-22, 2000, pp. 196-201. |
| 8) | |
Scott Popelar & Michael Roesch, "Flip Chip Reliability Modeling Based on Solder Fatigue as Applied to Flip Chip on Laminate Assemblies", IMAPS Workshop on Flip Chip, Braselton Georgia, March 4-5, 2000. |
| 7) | |
A.J.G. Strandjord, S.F. Popelar, and C.A. Erickson, "Breakthrough Developments in Electroless Nickel/Gold Plating on Copper Based Semiconductors", IMAPS Workshop on Materials, Braselton Georgia, March 6-8, 2000. |
| 6) | |
A.J.G. Strandjord, S.F. Popelar, and C.A. Erickson, "Low Cost Wafer Bumping Processes for Flip Chip Applications (Electroless Nickel-Gold / Stencil Printing)", IMAPS Proceeding, Chicago, IL, October 24-27, 1999, pp. 18-33. |
| 5) | |
A.J.G. Strandjord, S.F. Popelar, and C.A. Erickson, "Commercialization of a Low Cost Wafer Bumping Process for Flip Chip Applications", IMAPS Workshop on Flip Chip Applications, Braselton, Georgia, March 12-14, 1999. |
| 4) | |
S.F. Popelar, "A Parametric Study of Flip Chip Reliability Based on Solder Fatigue Modeling: Part II - Flip Chip on Organic", 31st International Symposium on Microelectronics Proceedings, 1998 IMAPS, San Diego, CA, November 1998, pp. 497-504. |
| 3) | |
S. F. Popelar and C.A. Erickson, "A Low Cost Wafer Bumping Process For Flip Chip Applications", 5th Annual Emerging Technologies Symposium Proceedings, Chandler, AZ, November 16-18, 1998, pp. 536-540. |
| 2) | |
Popelar, S.F., "An Investigation Into the Fracture of Silicon Die Used in Flip Chip Applications",IMAPS, Proceedings of the 1998 International Symposium on Advanced Packaging Materials, Braselton, GA, March 15-18, 1998, pp. 41-48. |
| 1) | |
Popelar, S.F., "A Parametric Study of Flip Chip Reliability Based on Solder Fatigue Modeling", Proceedings of the 21st International Electronics Manufacturing Technology Symposium, SEMI, Austin, TX, October 13-15, 1997, pp. 299-307. |
