Wafer Bumping Technologies:

	A) Electroless Ni/Immersion Au UBM plating.	Seven years of experience plating electroless nickel and immersion gold (e-Ni/Au) on semiconductor devices (1-35 µm tall). Applications include: flip chip wafer bumping, wire bonding, anisotropic conductive adhesives (ACA), high temperature environments, and wafer level packages (WLCSP).

	B) Solder deposition of wet paste or solid diameter spheres and reflow.	Stencil printed bumping services using solder paste or solid diameter spheres for flipchip and wafer level CSP. Serving military, automotive, medical and consumer market segments. High yield processing with eutectic PbSn (37/63), high lead (90/10), and lead free (SnAgCu) solder bumps.

	C) Inspection and test.	a. 100% inspection of wafers for bump yield. b. Sample plan for bump shear. c. Sample plan for bump height. d. Alloy composition tolerance of +/- 0.1 wt%

Capabilities/Throughput:

IC Interconnect has invested in state-of-the-art equipment and facilities. Quality systems are in place and have been certified to ISO/TS 16949 standards. The facility has a bumping capacity of over 250K wafers annually and is capable of processing wafers with the following characteristics:

Wafer Sizes:	3,4,5,6, and 8 inch (75-200mm), 12 inch (300mm) can be done in prototype
Wafer Types:	Silicon, GaAs, InP, SiGe, Glass
Pad Metallization:	100% Aluminum, Al/Si/Cu, Al/Si, Al/Cu, Copper in prototype
Passivation Types:	SiO2, Si3N4, PI, BCB, Photoresist
Backside Properties:	Oxide, Silicon, Ground, Metallized, Resist

Pricing:

A knowledgeable staff, proven technology, and a state-of-the-art equipment set are the keys to our high yielding bumping process. By eliminating vacuum metal desposition, photolithography, and etch processes, IC Interconnect is able to offer high quality wafer bumping at an attractive price.

Pricing is based on both wafer volume and services provided. In order to better quote the cost of a job, a Request For Quote has been provided in the menu of this web site which will allow IC Interconnect to assess the job requirements and then provide a written quote.