Press Releases

• Mar 26, 2007 - IC INTERCONNECT AND JCAP, A CHINESE COMPANY, FORM INTERCONTINENTAL ALLIANCE



• Sep 19, 2005 - IC INTERCONNECT ANNOUNCES NEW BACK-END CAPABILITIES



• Aug 9, 2005 - IC INTERCONNECT OFFERS LEAD-FREE WAFER BUMPING SERVICE



• May 2, 2005 - IC INTERCONNECT ACHIEVES ISO AUTOMOTIVE STANDARDS

Articles

• Nov 2005 - "Lead-free WLCSP Qualification" published in Advanced Packaging

Ads

• Complete Wafer Bump Services in the U.S. and CHINA