IC INTERCONNECT AND JCAP, A CHINESE COMPANY, FORM INTERCONTINENTAL ALLIANCE
COLORADO SPRINGS, Colorado – March 26, 2007 – IC Interconnect (ICI), a wafer bumping service company, announces an agreement with Jiangyin Changdian Advanced Packaging (JCAP), a company specializing in solder bump, gold bump and pillar bump mass production. The agreement brings ICI’s electroless Ni UBM processing technology to Asia, and JCAP’s multitude of bumping technologies to North America. IC Interconnect is the sole business representative for JCAP worldwide services in North America.
"This new relationship is truly beneficial to both IC Interconnect and JCAP,” says Curt Erickson, president of IC Interconnect. “We are excited to come together to offer our customers around the world more choices and flexibility for their wafer bumping needs."
The agreement establishes ICI/jcap International, a wholly-owned subsidiary of IC Interconnect. ICI/jcap International is the marketing, sales, engineering and customer support arm of JCAP in North America. It also makes available a facility where IC Interconnect can install and operate its electroless Ni UBM process in China. ICI/jcap International offers services in North America at IC Interconnect for the life of the product or migrate it from the U.S. to China as economics dictate, while providing seamless engineering and on-going customer support.
Customers can now:
- Pick a bumping technology
- Pick a process location
- Pick engineering and customer support time zones
JCAP, based in Jangyin, China, is the only factory in the world with a patent to produce copper pillar bumps. Additional technologies include thin film UBM, electroplated solder, gold bump and ball drop WLCSP. All are augmented with grind and back metal capabilities. Post bump processes include wafer test, laser mark, saw, tape and reel and mixed technology module assembly.
IC Interconnect
IC Interconnect, located in Colorado Springs, Colorado, was founded in 1998 as part of The Eagle Electronics group to provide wafer bumping services to the semiconductor industry. IC Interconnect offers low cost wafer bumping, backend die processing and supply chain management services. The company also fills a unique niche in the market, by providing fast delivery of high quality flip chip parts at competitive prices. IC Interconnect specializes in electroless nickel and immersion gold plating and pad resurfacing for semiconductor devices. IC Interconnect has the capacity to process over 240,000 wafers/year and has a standard turn time of 5 days. More information is available at www.icinterconnect.com.
JCAP (Jiangyin Changdian Advanced Packaging Co., Ltd.)
JCAP, located in Jiangyin, China, about three hours drive from Shanghai Pudong Airport, was founded in 2003 by three shareholders: JCET, APS and Lai Chih-Ming. JCAP’s major businesses are dedicated to wafer bumping and bump-related back-end service. For more information on JCAP, please visit www.jcap.cn.
