Wafer Bumping Products and Services:

	A) Conventional Flip Chip wafer bumping with lead or lead free solder alloys	a. E-Ni/Au + Eutectic Solder b. E-Ni/Au + High Lead Solder c. E-Ni/Au + SnAgCu
	B) WLCSP wafer bumping with lead and lead free solder alloys	a. E-Ni/Au + 250 µm Ball Drop b. E-Ni/Au + 300 µm Ball Drop c. E-Ni/Au + 500 µm Ball Drop
	C) I/O Resurfacing for wire bond enhancement & high temperature operations	a. E-Ni/Au (1-5 µm)
	D) Tall Ni for ACA applications	a. E-Ni/Au (5-35 µm)
	E) Solder wafer bumping on customer UBM	a. Supplied UBM + Eutectic Solder b. Supplied UBM + High Lead Solder c. Supplied UBM + SnAgCu
	F) Reliability Modeling	a. Solder Fatigue Modeling
	G) Backside Laser Marking	a. White mark b. Black mark
	H) Specialized Flip Chip Assembly	a. Flip Chip on 35mm reel to reel assembly
	I) Back-End Services