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ICI Library
- An Evaluation of Wafer Bumping Stencils Based on Solder Transfer Ratios and Predicted Bump Heights
- A Compatibility Evaluation of Lead-Based and Lead-Free Solder Alloys in Conjunction with Electroless Nickel / Immersion Gold Flip Chip UBM
- Evaluation of FlipFET™ Reliability Based on Solder Fatigue Modeling and a Simulated Design of Experiment
- Electroless Nickel/Gold Plating On Copper Based Semiconductors
- Flip Chip Reliability Modeling Based on Solder Fatigue as Applied to Flip Chip on Laminate Assemblies
- Breakthrough Developments in Electroless Nickel/Gold Plating on Copper Based Semiconductors
- Low Cost Wafer Bumping Processes for Flip Chip Applications (Electroless Nickel-Gold / Stencil Printing)
- Commercialization of a Low Cost Wafer Bumping Process for Flip Chip Applications
- A Parametric Study of Flip Chip Reliability Based on Solder Fatigue Modeling: Part II - Flip Chip on Organic
- A Low Cost Wafer Bumping Process For Flip Chip Applications
- An Investigation Into the Fracture of Silicon Die Used in Flip Chip Applications
- A Parametric Study of Flip Chip Reliability Based on Solder Fatigue Modeling
