Wafer Bumping and Related Services

Dedicated to Flawless Processing of 75-200mm Wafers

Technology, Quality, Capacity, and Customer Service at a Low Cost

Electroless nickel UBM combined with stencil printed solder offers the lowest cost wafer bumping solution available on the market. IC Interconnect's knowledgeable staff, quality systems, and attention to detail will make us your wafer bumping service provider of choice for flip chip, wafer level CSP, wire bond pad resurfacing and related services. We invite you to explore the site and then discuss your application with one of our regional sales managers.

IC Interconnect
1025 Elkton Drive
Colorado Springs, CO USA 80907
Phone: 719-533-1030
Fax: 719-533-1021
Email:ici@icinterconnect.com